W2L13C473MAT3S [KYOCERA AVX]

InterDigitated Cap;


型号：	W2L13C473MAT3S
厂家：	KYOCERA AVX
描述：	InterDigitated Cap
文件：	总2页 (文件大小：413K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IDC Low Inductance Capacitors (RoHS)

IDC (InterDigitated Capacitors) 0306/0612/0508

GENERAL DESCRIPTION

Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and

board level decoupling. The equivalent series inductance (ESL) of a single capacitor

or an array of capacitors in parallel determines the response time of a Power

Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A

designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-

Digitated Capacitor (IDC) device. These IDC devices are available in versions with a

maximum height of 0.95mm or 0.55mm.

0612

–

IDCs are typically used on packages of semiconductor products with power levels

of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and

ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices

are used on both ceramic and organic package substrates. These low ESL surface

mount capacitors can be placed on the bottom side or the top side of a package

substrate. The low proﬁle 0.55mm maximum height IDCs can easily be used on the

bottom side of BGA packages or on the die side of packages under a heat spreader.

0508

–

IDCs are used for board level decoupling of systems with speeds of 300MHz or

greater. Low ESL IDCs free up valuable board space by reducing the number of

capacitors required versus standard MLCCs. There are additional beneﬁts to

reducing the number of capacitors beyond saving board space including higher

reliability from a reduction in the number of components and lower placement costs

based on the need for fewer capacitors.

0306

TYPICAL IMPEDANCE

The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is the

second family of Low Inductance MLCC products created by AVX. IDCs are a cost

effective alternative to AVX’s ﬁrst generation low ESL family for high-reliability

applications known as LICA (Low Inductance Chip Array).

MLCC_1206

LICC_0612

0.1

AVX IDC products are available with a lead-free ﬁnish of plated Nickel/Tin.

IDC_0612

0.01

0.001

100

1000

Frequency (MHz)

HOW TO ORDER

225

Style IDC Case

Low

Inductance

Number of Voltage Dielectric Capacitance Capacitance Failure Termination Packaging

Thickness

Max. Thickness

mm (in)

A=Standard

S=0.55 (0.022)

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

C = X7R

D = X5R

Z = X7S

T =Plated Ni

and Sn

Available

1=7" Reel

3=13" Reel

Size

Terminals

1 = 8 Termi-

nals

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Rate

2 = 0508

3 = 0612

4 = 0306

M = ±20%

A = N/A

NOTE: Contact factory for availability of Termination and Tolerance Options for Speciﬁc Part Numbers.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance ±20% Preferred

No problems observed after 2.5 x RVDC for 5

seconds at 50mA max current

Dissipation Factor

X7R = -55°C to +125°C

X5R = -55°C to +85°C

X7S = -55°C to +125°C

Operation

CTE (ppm/C)

12.0

Temperature Range

Thermal Conductivity

4-5W/M K

Temperature

Coefﬁcient

Voltage Ratings

±15% (0VDC), ±22% (X7S)

Terminations

Available

Plated Nickel and Solder

4, 6.3, 10, 16, 25 VDC

≤ 6.3V = 6.5% max;

Dissipation Factor

10V = 5.0% max;

≥ 16V = 3.5% max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per μF

min.,whichever is less

The Important Information/Disclaimer is incorporated in the catalog where these speciﬁcations came from or

available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

IDC Low Inductance Capacitors (RoHS)

IDC (InterDigitated Capacitors) 0306/0612/0508

SIZE

W4 = 0306

0.55

W2 = Thin 0508

0.55.

W2 = 0508

0.95

W3= Thin 0612

0.55

W3 = 0612

0.95

W3 = THICK 0612

1.22

Max.

Thickness (in.)

(0.022)

(0.037)

(0.022)

(0.037)

(0.048)

WVDC

6.3

6.3 10 16 25

6.3 10 16

6.3 10 16 25

6.3 10 16

Cap (μF) 0.010

0.022

0.033

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

Consult factory for

additional requirements

PHYSICAL DIMENSIONS AND PAD LAYOUT

= X7R

= X5R

= X7S

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONSMILLIMETERS (INCHES)

SIZE

1.60 ± 0.20

0.82 ± 0.10

0.25 ± 0.10

0.20 ± 0.10

0.40 ± 0.05

0.38 0.89

1.27

0.20

0.40

0306

(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002)

2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05

(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002)

3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10

(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)

(0.015) (0.035) (0.050) (0.008) (0.015)

0.64 1.27

(0.025) (0.050) (0.075) (0.011) (0.020)

0.89 1.65 2.54 0.45 0.80

(0.035) (0.065) (0.010) (0.018) (0.031)

1.91

0.28

0.50

0508

0612

0508

0612

The Important Information/Disclaimer is incorporated in the catalog where these speciﬁcations came from or

available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

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